9999%. [1] It occurs naturally in outer space, and can be an unwelcome source of wear in precision components. Argon of 99. Refined grain structure of FeCo Target. 99%. Only few studies report on the creation of nanoporous gold from alloy thin film deposited by magnetron co-sputtering. 999% Shape: Discs, Plates, Column Targets, Step Targets, Custom-made Platinum sputtering target is available in various forms, purities, sizes, and prices. Three mosaic targets have been used for easily. In physics, sputtering is a phenomenon in which microscopic particles of a solid material are ejected from its surface, after the material is itself bombarded by energetic particles of a plasma or gas. The presented results of studies on thin films of germanium–gold alloy (Ge–Au) are discussed in terms of choosing the optimal deposition process and post-processing conditions to obtain layers with the best thermoelectric properties. 8V between 20 and 220 min. The successful production of gold alloy coatings of controlled composition now offers a much wider choice of materials to the designer of light duty electrical contacts. PVD Gold Sputtering. Concerning physical methods, molecular beam epitaxy [Citation 12], sputtering [Citation 13, Citation 14] and pulsed laser deposition [Citation 15], are among the most common approaches. %), silver. Gold along with silver and copper, form a column in the periodic table. Glancing angle deposition with a rotating substrate is needed to obtain vertical. China Alloys Sputtering Targets manufacturers - Select 2023 high quality Alloys Sputtering Targets products in best price from certified Chinese Targets, Corrosion Resistant Alloys suppliers, wholesalers and factory on Made-in-China. • Resistant to creep. Excellent uniformity if you are using planetary and masks (but poor without) Low level of impurity. The Ionbond ™ PVD process is used for the deposition of coatings made of nitrides, carbides and carbonitrides of Ti, Cr, Zr and alloys like AlCr, AlTi, TiSi on a large range of tools and components. While the compositions of the films do not perfectly match those of the targets, the differences are limited to 5 at. In such a process, one of the metals, e. % of Ta). Chambers and C. In this work, we developed an atomic layer deposition (ALD) process for gold metal thin films from chloro (triethylphosphine)gold (I) [AuCl (PEt 3 )] and 1,4-bis (trimethylgermyl)-1,4-dihydropyrazine [ (Me 3 Ge) 2 DHP]. The base pressure of the sputter system was 10−6 Pa. However re-examination. Not surprisingly, different target materials sputter at different rates. 4 XRD texture Analysis of As-deposited CuNi Bilayer and Alloyed Films 6 2. These images of a spent nickel-vanadium sputtering target show the classic "race track" erosion pattern (valley). Glancing angle deposition with a rotating substrate is needed to obtain vertical. Preheat gently to outgas. 18, which is about 4 1 based on the EDS result. 084000000 Platinum. Written by Matt Clancy Published on February 1, 2023 Gold sputtering is a method for adding a thin layer of gold to various surfaces, such as circuit boards, metal. Gold is naturally a chemical element that’s heavy and occurs in rocks and can sometimes occur as flakes. PVD Gold Sputtering. Pros. Made available by U. composition (80. Thin metal films (<<100 nm. investigated the surface structure and composition of three different surface terminations of this particular alloy. R-T-P stage for the larger chamber coaters: Auto Sputter Coater, Auto Carbon Coater, High Resolution Sputter Coater, SEM Turbo Carbon Coater and TEM Turbo Carbon Coater. The obtained colloidal particles, synthesized in an aqueous, room-temperature environment, can be tailored to a variety of applications through changing the size, ratio of metals. Figure 1. Common gold alloys, including Au–Ag, are soft and malleable. L. Objectives: This study aimed to measure non-destructively gold (Au) electrodeposited on a high-gold alloy by modulating coating time and comparing this to sputtering Au to known thicknesses. 845. Machining tools are,. American Elements specializes in producing high purity Silver Gold Alloy Sputtering Targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. The microstructure and chemical composition of the brazed interfaces were analyzed by scanning electron microscopy and by energy dispersive X-ray spectroscopy,. Journal Article: Sputtering of neutral clusters from silver-gold alloys. The content of the alloying metal is usually kept low because gold alloys look less and less like gold as the content of the other alloying metal is increased. 1 to 0. Gold-tantalum alloy films are of interest for biomedical and magnetically-assisted inertial confinement fusion applications. Properties such as relative density, grain size and orientation, and magnetron sputtering characteristics were investigated in the W/Re alloys. sputtering targets are made from high-purity elemental metals. This paper presents the various features of the physical vapor deposition (PVD) process as it applies to gold coating applications. 6 is considered as a HEA [ 1, 12 ]. Goodfellow has 8 high quality gold sputtering target products in stock from a selection of 70,000 specialist materials for R&D. Order online now Free standard delivery and 48 hour despatch on over 150,000 in-stock advanced scientific materials An alloy with a mixing entropy Δ Smix ≥ 1. Gold Antimony, Au/Sb Gold Arsenic, Au/As Gold Boron, Au/B Gold Copper, Au/Cu Gold Germanium, Au/Ge Gold Nickel, Au/Ni Gold Nickel Indium, Au/Ni/In Gold Palladium, Au/Pd Gold Phosphorus, Au/P Gold Silicon, Au/Si. Alloy ingots. If we assume a binomial. Composition: Cr. Three different NiO x thin films were sputtered on fluorine-doped tin oxide (FTO) substrates without intentional heating using a Denton Vacuum DESKTOP PRO sputter deposition system (Denton Vacuum LLC). Many translated example sentences containing "blanco Sputtering" – English-Spanish dictionary and search engine for English translations. The sputtering power was kept at 30 W, and the background pressure was maintained at 5 × 10 −3 Torr with a 40 sccm gas flow of argon (Ar). Sputter deposition has the deserved reputation as being the technique for preparing thin films of alloys and complex materials for industrial application. However, the great majority of species sputtered from clean metal alloy surfaces are neutral so testing of cluster ejection and formation models requires measurement of the neutral species, using a technique such as laser post-ionisation [1]. The inhomogeneous lattice strain. DOI: 10. Capabilities include flat lapping, melting, polishing, rolling, stamping, surface grinding, turning and wire drawing. 22. Here, we systematically study the effects of substrate tilt ( 0 ° – 80 ° ) and negative substrate bias (0–100 V) on properties of ≲ 3-μ m-thick films deposited by high-power impulse magnetron sputtering (HiPIMS) from a Au–Ta alloy target (with 80 at. In this paper, the electric and thermoelectric properties of thin films of germanium–gold alloy (Ge–Au) are discussed in terms of choosing the optimal deposition process and post-processing conditions to obtain Ge–Au layers with the best thermoelectric parameters. 05. Metal nanoparticles synthesis is a topic of great interest for various applications in science and technology. Gold alloys were initially used to fabricate archwires because they are inert, biocompatible, and stable. soldered assembly which will interact with the deposited AuSn layer during soldering. Highlights Sputter deposited Mg–Zr alloys were developed as corrosion resistant magnesium-based alloys. Comparable to the weight of 14k gold. The fabrication of black-gold coatings using sputtering is reported here. Polycrystalline Ag, Ag 20Au 80, Ag 40Au 60, Ag 80Au 20 and Au samples were bombarded with 15 keV Ar + at 60° incidence and the resulting secondary neutral yield distribution was studied by non-resonant laser postionisation mass spectrometry. American Elements manufactures a comprehensive catalog of alloy materials in numerous forms and compositions. The target substance might be an alloy, ceramic, or compound. Only few studies report on the creation of nanoporous gold from alloy thin film deposited by magnetron co-sputtering. Binary alloys containing 6–26 at. solchenbach@tum. White gold (and yellow gold) is measured in karats. Sputtering has become one of the most widely used techniques for depositing various metallic films on wafers, including aluminum, aluminum alloys, platinum, gold, TiW, and tungsten. %) have been prepared by DC magnetron sputtering onto SiO x substrates. Wrap-around dark-space shield. 966569. Other Alloys. With a tensile strength of 40,000PSI, this solder is much more rigid than the tin solder. % nickel and 6–57 at. Platinum (atomic symbol: Pt, atomic number: 78) is a Block D, Group 10, Period 6 element with an atomic weight of 195. Sputter deposition. Its purest form is a bright, slightly reddish yellow, dense, soft, malleable, and ductile metal. 0, 33. This work reports the ellipsometry analysis of atomic layer deposition (ALD) films of ZnO doped with Zr to determine parameters like free carrier concentration and mobility. Average lead time: 1 to 180 days. Buy 99. 3, pp. Conclusion. 18, which is about 4 1 based on the EDS result. Zinovev and Michael J. ; Xia, Y. 1. The alloys have single phase solid alloy structure. Gold is transported unreacted from a gold target to the substrate in a nitrogen plasma to form polycrystalline films, but gold alloys. Nano Al films were prepared on AZ31 magnesium alloy samples by DC magnetron sputtering. [26] suggest that AlAu n +1 have similar ionization potentials to Au n due to the formation of inert AuAl ‘molecules’ in the clusters. Rev. Target Material Selection for Sputter Coating of SEM Samples - Volume 27 Issue 4. These samples were annealed at 350oC. Sputtering is a plasma based deposition process in which energetic ions are accelerated towards a target. These catalysts comprise in many cases of metallic gold since this is shown to be the active form for many reactions, (11, 20, 21) whereas as we have shown in this paper for acetylene hydrochlorination, it is the cationic form of gold that is the active. See more Platinum products. Nano Al films were prepared on AZ31 magnesium alloy samples by DC magnetron sputtering. Precious Alloys target. 2. Free standard delivery and 48 hour despatch on over 150,000 in-stock advanced scientific materialsStill, in today's economy, its most popular use is as jewelry. As source material for coating, the quality of gold alloys target has great effects on sputtering technological parameters and performances of coatings. Gold-tantalum alloy films are of interest for biomedical and magnetically-assisted inertial confinement fusion [email protected] Elements specializes in producing high purity Silver Lead Alloy Sputtering Targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Typical electrochemical behaviour of gold electrodes was observed during measurement in acidic medium (H 2 SO 4 and BR pH 2). Gold is a soft metal and is usually alloyed to give it more strength. Definition of Magnetron Sputtering. Alloys: Name: Purity: Form: Sliver Gold Alloy. After preparing. The Agar Scientific Combined Coater System offer gives you all the necessary equipment and accessories in one bundle. NeutralDesigned for routine applications, the SC7620 uses a basic magnetron sputter head with a simple-to-replace disc target (gold/palladium as standard). 9999%) sputtering targets and other deposition materials for all applications using both vacuum melt/casting and hot isostatic pressing (HIP) technology. Sputtering as a deposition technique may be described as a sequence of these steps: 1) ions are generated and directed at a target material; 2) the ions sputter. This article studies two different sputtering methods for depositing Ag–Mo and Ag–Zr alloy films on single crystal silicon (Si), flexible polyimide (PI) and soda-lime glass substrates. The resulting omni-directional deposition of sputtered. 5 R and atomic size difference δ < 6. This phenomenon is put to good use in sputtering systems to prevent unwanted sputtering of components held at high voltage. soldering the AuSn alloy composition will shift through the eutectic composition towards the Au-rich . The Mo layer was used as conducting back contact on a CIGS solar cell. Process (2): Solder pasting/solder sputtering/Ti/Al/Si wafer (no use of Au or Ni) This process eliminates the use of Au and Ni in order to further reduce electrode film material costs. The joining of alumina (Al 2 O 3) to γ-TiAl and Ti6Al4V alloys, using Ag-Cu sputter-coated Ti brazing filler foil, was investigated. The Au-Cu thin film were deposited by DC co-sputtering in pure argon plasma of an Au (diameter: 76. This process is called dealloying [1]. 47 Ag/Au alloy nanoparticles were synthesized by the reduction of changeable molar fractions of HAuCl 4 ·3H 2 O and AgNO 3 using TSC as the reducing chemical and PVP as a stabilizing agent. Features. Platinum (atomic symbol: Pt, atomic number: 78) is a Block D, Group 10, Period 6 element with an atomic weight of 195. 9% to 99. Karat golds will work-harden when rolled, drawn, or forged. 3 Effect of Substrate Temperature During Sputtering 5 2. ; Xia, Y. Plasmaterials, Inc. The 80/20 gold/tin eutectic composition: • Reflows at 280°C. Sputtering preferred; or co-evaporate from two sources, permalloy and molybdenum. Purity: 99. Au, AuGe alloy and other gold alloys can be deposited on the surface of the chip by sputtering or evaporation. 999 percent. Plasmaterials, Inc. Ion energy was varied from 200 to 1000 eV, ion current density from 0. Magnetron sputtering applies a magnetic field around the target in order to energize argon atoms for bombarding the target. Metal reacts quickly in air. For sputtering over extended time periods, be sure to move the sample away from the gun to cool from time to time. Sputtering of neutral clusters from silver-gold alloys. The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to. The deposition time is 15 min, the sputtering power for targets of W and. Gold Alloys. , 99. de. Our portfolio includes Cr, NiFe and alloys of C, Mo and W. Probably the most common practice is to simply sputter the alloy or composite material from a homogeneous alloy or composite of the material composition which is to be desired in the resultant film. With. Thin films of beryllium and gold that are several tens of nanometers thick were obtained, for the first time, on silicon and quartz substrates by the ion-beam method with tenfold alternation of deposition and partial sputtering of the nanosized metal layer. JX Metals Corporation has broad lineup of sputtering targets for semiconductor devices, flat panel displays, hard disc drives, photovoltaic cells, and many other products. However, this deposition technique allows easy tune of the morphology at nanoscale. The effects of RF sputtering power and Ar gas pressure on the structural and electrical properties of the films were investigated experimentally, using a 2. 1 Introduction. The process involves exciting the atoms of the target or source material — typically, discs of solid gold or gold alloy — by bombarding them with high. With the acquisition of the Heraeus target business, we offer an even wider variety of precious and non-precious metal targets. Starting with the groundbreaking work of Cantor et al. soldered assembly which will interact with the deposited AuSn layer during soldering. 9% purity) with a throw distance of 5. Thus during . After preparing. [] and Yeh et al. 2. 9% purity to the highest, 99. the less noble one, is selectively removed from the alloy, while the atoms of the more noble metal diffuse and reorganize into a particular structure, e. Reason: At the target, the argon has achieved high enough energy to sputter the Al and Cu evenly. For Ni/Au with an ion energy of 1 keV, the gold was sputtered preferentially. Introduction and motivation for scrap-based aluminum alloys. g. A more effective method is sputter coating the sample to give it a conductive coating. Sputtering is one method of the PVD (Physical Vapor Deposition. Process for heat harden select alloys, anneal for 30 minutes at 1250°F (676°C) followed by rapid water quenching. Magnetron sputtering is a deposition technology involving a gaseous plasma. In the late 1990s and the early 2000s, researchers. Abstract. GOV. Moore and Igor V. The effects of substrate properties and sputtering methods on. In addition, incorporating a second metal as an alloy with gold can enhance the catalyst performance even more. KAWASHIMA, K. After deposition thin films were annealed in the atmosphere of N 2 at various temperatures (473. The gold in the alloy nanoparticle reduces the leaching of silver from the particle and increases biocompatibility. The fabrication of black-gold coatings using sputtering is reported here. Refining Systems, Inc. We have studied the deposition of AlCoCrCuFeNi high-entropy alloy thin films on Si (100) substrates by a dc magnetron sputtering process. 999 percent. 95%, 99. KT Spec Sheets & Special Comments;. 5. , the sputtering of the target material. 3 g/cc, and a vapor pressure of 10 -4 Torr at 1,132°C with its ideal evaporation temperature being around 1,400°C. T. ions cease to be produced and sputter- ing stops. com 86--18015519516 Inicio. Gold (Au) thin films were deposited on glass (SiO2) and silicon (100) substrates at room temperature (RT) in an argon (Ar) gas environment as a function of sputtering time. 5 °F Melting point of copper: 1084 °C / 1983 °F Melting point of iron: 1538 °C / 2800 °F Melting point of lead: 327. de l. 999%. 5 to 99. Sputtering is one method of the PVD (Physical Vapor. 3 Pa) and 2 kV were 1. Above is a selection of offerings from the AEAlloys™ line; you may also request a quote directly for a material. Class 100 cleanroom. The number of electrons in each of platinum's shells is [2, 8, 18, 32, 17, 1] and its electron configuration is [Xe] 4f 14 5d 9 6s 1. Suzhou Haichuan Rare Metal Products Co. High material utilization efficiency. Reason: At the target, the argon has achieved high enough energy to sputter the Al and Cu evenly. Soleras’ capabilities include direct HIPing to backing tubes for certain materials; the result is high-power usage without application of bonding solder. Fax# 408-729-0277. Our international partnerships with leading material transformers and cost effective metallic powder suppliers allows us to offer the greatest variety of cathode sputtering targets for thin film. The morphology, stress, resistance and optical properties were. Hi Paul, I am learning about sputter vapor deposition of Gold/Silver/Copper metals and it is apparently a poor choice to apply them directly to an oxide, silicon, or insulating base layer. as an adhesion layer for less adhesive metals such as gold [Williams2003] . On the contrary, the sputtered film will have particles, and the thickness of 10nm is difficult to achieve precise and controllable. All films deposited at base pressure of approximately 5 × 10 −7 Torr. To harden, heat to 650°F (343°C) for 30 minutes, quench or air cool. Uniform, highly porous, columnar thin films incorporating YSZ and NiO prepared by magnetron sputtering with deposition at glancing incidence exhibited stoichiometries close to that of the Y–Zr. For materials that have been calibrated, the control effect is below 10nm. 32, No. (2) The capability to deposit and maintain complex alloy compositions. 05. Here, we describe direct current magnetron sputter deposition of ∼ 10 − μ ∼ 10 − μ m-thick films of Au-80 at. Colored gold is the name given to any gold that has been treated using techniques to change its natural color. Aluminum is a material with two facets when it comes to sustainability [3], [4]. To know. E-beam best. 99%, 99. Since its discovery during ancient times, it has been utilized as jewelry, coins, and tools. Like other sputtering target materials, gold sputtering targets have similar properties as pure metal gold. An alloy target was used for sputtering, with a composition of Cr 18 Mn 20 Fe 20 Co 21 Ni 21, as analyzed by inductively coupled plasma mass spectrometry (ICP–MS), and a purity of 99. The discovery that supported gold nanoparticles are exceptionally effectivecatalysts for redox reactions has led to an explosion of interest in gold nanoparticles. 2mm dia from Goodfellow. • Now, since the surface has more of B, more of it will sputter off. Gold target 57mm dia x 0. Gold-platinum alloy sputtering targets are used in a range of applications, particularly in the electronics and sensor. Abstract. 75%Sn) due to the existence of a gold layer on the opposing surface of the . The all but pure gold is refined with one percent of titanium. This study produces (AlCrNbSiTiV-W)N films onto soda-lime glass and SUS 304 stainless steel substrates using reactive co-sputtering. Secondary electron yields are high, and sputter rates for Au/Pd are only slightly lower than for pure Au. Suffern, NY Manufacturer* $1 - 4. The relative proportion of Ag to Au in the alloy is 79. Ranging from 5KT to 24KT all of our yellow gold is eco-friendly. For a base metal, a Zircaloy-4 alloy (1. With the advent of high-entropy alloys (HEAs) in the early 2000s, [1, 2] the research activities in the branch of physical metallurgy gained new momentum as witnessed by the huge amount of papers produced on these materials. e. It can be found in kitchen utensils, cars, street lights, and the popular aluminum foil food packaging. 1 Sputter deposition rates for Cu and Ni films 3 2. These techniques involve the plasma or discharge of noble or reactive gas atoms. Plasmaterials, Inc. The Si thin film substrate was prepared by magnetron sputtering deposition technique with the deposition rate about 10 nm/min. One of the targets was fabricated from a homogeneous HEA powder produced via gas atomisation; for the second target, a mixture of pure element powders was used. Then, we controlled the composition of the alloy by regulating the sputtering power of each element. Then, we controlled the composition of the alloy by regulating the sputtering power of each element. As source material for coating, the quality of gold alloys target has great effects on sputtering technological parameters and performances of coatings. Gold sputtering target can be used in LED lighting applications. Most alloys with greater than 50% gold are resistant to tarnish and corrosion. Order online now Free standard delivery and 48 hour despatch on over 150,000 in. Just like the pure gold metal, the gold sputter target also has a relative atomic mass of gold. To date, Fe 70 Pd 30 alloy films have been produced by both physical and (electro)chemical methods. High deposition rate of <100 Å/s (better than sputtering or resistive thermal evaporation) for high throughput. Good for metals and dielectrics with high melting points. Chemical Formula: Au/Pd. 99% purity Ga 2 O 3 ceramic target with diameter of 2 inch and thickness of 0. 999 percent. Cu-Ni and Pd-Ni In addition to the one phase binary systems being analyzed by comparing scribed and fractured samples with sputtered ones, also AES. Precipitation strengthening is an effective approach in Mg alloys, and hence, it is worthwhile investigating the properties of the Mg-containing intermetallics. 3 shows four structures in the gold Au 4f BE region; the most intense doublet at higher BE immediately proves that the major part of the surface gold atoms is oxidized. 9999%. Abstract. 1458 Seareel Place San Jose CA 95131. Gold sputtering targets can be deposited on a semiconductor chip such as GaAs, GaP, GaN, or the like by sputtering, and can form an ohmic contact film, an electrode, and a wiring film, thereby improving the conductivity and working efficiency of the semiconductor. After. Our standard sputtering targets for thin film deposition. 998% purity was introduced as working gas into the deposition chamber with a mass flow. Noble Metals (Chemistry) Hubert Schmidbaur, John L. The targets are then machined to within the tolerances of the. Wets but does not alloy with refractory metals. See moreAbstract. The conclusions from these studies are not in agreement, ranging from very little surface segregation [2,4] to a definite gold enrichment of sputtered and annealed alloy surfaces [3,5]. Au/Pd is often recommended to achieve a smaller grain size. The Physical Vapor Deposition Process for Semiconductor Coatings. Bland-Hawthorn, G. Send your request to sales@edge-techind. At a deposition temperature of 500 °C, the (200) texture became stronger. The aim of this report is to present a systematic study on the fabrication, characterization of Ag/Au alloy NP-based surface-enhanced Raman spectroscopy (SERS) substrates. 125 inch that was purchased from Plasmaterials Inc. Technologies that produce fine-grained targets that deliver uniform thin film coatings. Soleras also provides sintered ceramic rotaries (AZO. The deposition temperature affected the texture which showed (111) preference up to 300 °C. 80 ± 2. 9% to 99. DOI: 10. The effects of sputtering power on the microstructure and corrosion resistance of the Al film were investigated. ALB Materials Inc provides many kinds of Sputtering Targets with high quality at competitive price. The gold germanium sputtering target is available in various forms, purities, sizes, and prices. Atomic Number: 74. S. % at most. Eutectic bonding is based on the ability of silicon (Si) to alloy with numerous metals and form a eutectic system. This work aims to provide information about the deposition of gold via bipolar high-power impulse magnetron sputtering (HIPIMS) in order to identify suitable process parameters. Cerium oxide based coatings from ∼100 to ∼1400 nm in thickness were deposited onto Al 2024-T3 alloy substrates by magnetron sputtering of a 99. DC magnetron sputtering was used on an 8″ single alloy target (Testbourne Ltd. Magnetron sputtering is a commonly used method of physical vapor deposition (PVD), which is a thin-film deposition technique. As gas pressure is decreased with a glow discharge the size of the dark space increases due to the largerGa 2 O 3 thin films were deposited by RF- magnetron sputtering via 99. % nickel and 6–57 at. Changes in the surface composition of one-phase binary alloy systems and of the ternary system Ag-Au-Cu have been studied under 1 or 2 keV Argon ion bombardment using Auger Electron. Density: 7. Applications include cutting and forming tools, mechanical components, medical devices and products that benefit from the hard. The process involves exciting the atoms of the target or source material — typically, discs of solid gold or gold alloy — by bombarding them with high-energy. Less intense signals at 1. A panel-mounted switch allows the system to be changed between sputter coating and glow discharge modes. Description for Gold Sputtering Targets Gold is one of the most valuable and sought-after metals in the world. X-ray diffraction patterns of templated Fe-Ga alloy with 20 at. Gold-tin alloys of various compositions are available. The color is darker, more gray, than rhodium plated white gold. Alloy is usually obtained by fusing the respective molten components and cooling from high temperature to become condensates. Silver-Gold alloy/diamond like carbon (Ag-Au/DLC) nanocomposite films were prepared by co-deposition of RF-sputtering and RF-PECVD on glass substrates by using acetylene gas and silver. Good directionality. Gold sputtering is a method for adding a thin layer of gold to various surfaces, such as circuit boards, metal jewellery, or medical implants, through physical vapour deposition (PVD). Sputtering targets are produced to fit all commercially available cathode configurations as well as for custom and customer specified designs. The most established eutectic formations are Si with gold (Au) or with aluminium (Al). Here, δ can be defined from the below equation: (3) where n is the number of elements, z is the molar fraction of the ith element, r is the atomic radius of the i th element, and is the mean atomic radius. Thin Cu–Al alloy films of different thicknesses ranging from 3 to 300 nm and two different Al contents (1 and 2 at. PVD - SPUTTERING DEPOSITION - PHYSICAL VAPOR DEPOSITION - SPUTTERING THIN FILMS METALS ALLOYS DIELECTRICS DC RF MAGNETRON SPUTTER DEPOSITION AND REACTIVE SPUTTERING, (Cr)60(SiO)40 Chromium 60% - silicon monoxide 40%, (In2O3)80(SnO2)20 Indium oxide 80% - tin oxide 20%, (In2O3)85. Platinum (atomic symbol: Pt, atomic number: 78) is a Block D, Group 10, Period 6 element with an atomic weight of 195. La técnica de magnetrón sputtering se ha desarrollado rápidamente durante la última década, hasta establecerse como el proceso elegido para el depósito de una amplia gama de recubrimientos de importancia industrial.